Tsmc Standard Cell Naming — Convention

Older nodes (e.g., 180nm, 130nm) may use SVT (Standard Vt) instead of RVT. 3.4 Physical Variant Modifiers These indicate special layout arrangements.

| Code | Relative drive | |------|----------------| | X0.5 | Ultra-weak | | X1 | Unit drive | | X2 | 2× unit | | X4 | 4× unit | | X8 | 8× unit | | X16 | Max drive | tsmc standard cell naming convention

INVX4 drives four times stronger than INVX1 . 3.3 Threshold Voltage (Vt) TSMC offers multiple Vt options to trade leakage power vs. speed. Older nodes (e

| Code | Meaning | |-----------|--------------------------------------------------------| | (none) | Regular height, standard pin placement | | _D | Double-height cell (for higher drive or reduced IR drop) | | _P | Pin access optimization (better routing) | | _F | Flip-pin (mirrored for abutment) | | _CK | Clock-specific cell (low jitter) | | _ISO | Isolation cell (power gating) | | _LS | Level shifter | | _RO | Ring oscillator cell (test) | In N7, N5, N3, TSMC uses multiple metal track heights. | Code | Vt type | Speed |

| Code | Vt type | Speed | Leakage | |-------|----------------|-------|---------| | LVT | Low Vt | Fast | High | | RVT | Regular Vt | Medium| Medium | | HVT | High Vt | Slow | Low | | ULVT | Ultra-low Vt | Fastest| Highest | | ELVT | Extreme low Vt | (deprecated in some nodes) | |

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